Nanolex Polishing Pad Medium DA 150x25 (2X τεμάχια)
Koch Chemie Micro Cut Pad 126 x 23 mm
Koch Chemie Micro Cut Pad Ø 126 x 23 mm
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Micro Cut Pad
High-quality special sponge for removing fine scratches, holograms and polishing marks using the Micro Cut M3.02 and Micro Cut & Finish P3.01. The short height of 23mm creates low torsion forces, very good handling and the highest level of stability. The special density of the foam material enables long-lasting compression hardness during polishing. The optimised reticulation (open cellular structure) and cell count contribute to a high-shine finish and very good hygiene factors. The milling edge ensures extra flexibility for the pads, enabling them to fit around contours easier. The colourful non-woven material, suitable for polishing, ensures process safety.
Compression hardness: 10. Abrasiveness: 5.
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